TQP3M9008 high linearity lna gain block data sheet: rev. j - 1 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? applications 3 - pin sot - 89 package ? ? ? ? product features functional block diagram ? ? ? ? ? ? ? ? ? general description pin configuration the tqp3m 9008 is a cascadable, high linearity gain block amplifier in a low - cost surface - mount package. at 1.9 ghz, the amplifier typically provides 2 0 .6 db gain, + 36 dbm oip3, and 1. 3 db noise figure while only drawing 85 ma current. the device is housed in a lead free/green/rohs - compliant industry - standard sot - 89 package using a nipdau plating to eliminate the possibility of tin whiskering. the TQP3M9008 has the benefit of having high gain across a broad range of frequencies while also providing very low noise. th is allows the device to be used in both receiver and transmitter chains for high performance systems. the amplifier is internally matched using a high performance e - phemt process and only requires an e xternal rf choke and blocking/ bypass capacitors for ope ration from a single +5v supply. the internal active bias circuit also enables stable operation over bias and temperature variations. the TQP3M9008 covers the 0.05 - 4 ghz frequency band and is targeted for wireless infrastructure or other applications req uiring high linearity and/ or low noise figure. ordering i nfo rmation part no. description tqp3m9 008 high linearity lna gain block TQP3M9008 - pcb _if TQP3M9008 e vb 0.05 - 0.5 ghz TQP3M9008 - pcb_rf TQP3M9008 e vb 0.5 - 4 ghz standard t/r size = 1000 pieces on a 7 reel. pin # symbol 1 rf input 3 rf output / vcc 2, 4 ground rf in gnd rf out gnd 1 2 3 4
TQP3M9008 high linearity lna gain block data sheet: rev. j - 2 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature - 65 to +150 c rf input power, cw, 50 , t = 25 c +23 dbm device voltage,v dd +7 v reverse device voltage - 0.3v operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max unit s v dd + 3 +5 +5.25 v t( case ) - 40 85 c tj (for >10 6 hours mttf ) 190 c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifi cations test conditions unless otherwise noted: +25 c, + 5 v vsupply, 50 system. parameter conditions min typical max unit s operational frequency range 50 4000 mhz test frequency 1900 mhz gain 19 20 .6 2 2 db input return loss 1 6 db output return loss 1 7 db output p1db + 20 dbm output ip3 pout= 3 dbm/tone, f= 1 mhz ) j b 38.7 c/w
TQP3M9008 high linearity lna gain block data sheet: rev. j - 3 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? device characterization v dd = +5 v, i dd = 85 ma, t = +25 c, calibrated to device leads freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 - 12.52 - 170.01 23.61 172.94 - 26.71 0.57 - 9.82 177.18 100 - 11.90 - 175.09 23.48 167.73 - 26.65 - 1.85 - 9.88 171.87 200 - 11.41 177.96 23.07 159.45 - 26.63 - 5.51 - 10.01 162.15 400 - 11.36 166.96 22.66 144.06 - 26.65 - 12.85 - 10.48 145.49 600 - 11.58 154.05 22.31 129.39 - 26.65 - 19.62 - 10.67 129.34 800 - 11.76 147.21 21.98 114.61 - 26.71 - 26.09 - 11.30 111.77 1000 - 12.33 139.09 21.71 99.52 - 26.78 - 33.35 - 12.37 94.27 1200 - 12.65 132 .05 21.41 85.59 - 26.92 - 39.92 - 13.06 77.75 1400 - 13.27 126.25 21.02 70.96 - 27.11 - 47.72 - 14.33 58.69 1600 - 13.58 116.91 20.78 56.21 - 27.39 - 56.48 - 15.41 36.83 1800 - 13.92 110.23 20.45 41.84 - 27.60 - 63.31 - 16.28 15.29 2000 - 14.30 103.50 20.30 27.87 - 28. 05 - 71.56 - 17.53 - 11.21 2200 - 15.07 94.63 19.92 13.81 - 28.50 - 80.24 - 18.03 - 39.05 2400 - 15.75 85.16 19.71 - 1.08 - 28.73 - 88.86 - 17.43 - 65.92 2600 - 16.78 72.66 19.45 - 15.98 - 29.42 - 96.81 - 16.62 - 94.17 2800 - 18.00 55.24 19.22 - 31.32 - 29.90 - 105.73 - 14.89 - 115.00 3000 - 19.76 25.52 18.95 - 46.86 - 30.63 - 117.08 - 14.06 - 131.67 3200 - 19.90 - 16.80 18.64 - 63.51 - 31.00 - 128.03 - 13.12 - 148.29 3400 - 17.79 - 58.97 18.31 - 80.47 - 31.77 - 139.44 - 12.40 - 160.20 3600 - 14.26 - 90.75 17.71 - 98.47 - 32.84 - 154.36 - 11.92 - 173. 86 3800 - 11.29 - 114.34 16.98 - 117.12 - 33.98 - 168.14 - 11.23 174.45 4000 - 8.73 - 132.65 16.09 - 135.80 - 34.80 173.11 - 10.66 167.57
TQP3M9008 high linearity lna gain block data sheet: rev. j - 4 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? application circuit configuration bill of material reference designation frequency (mhz) TQP3M9008 - pcb_if TQP3M9008 - pcb_rf 50 - 500 500 - 4000 q1 TQP3M9008 c2, c6 1000 pf 100 pf c1 0.01 uf 0.01 uf l2 330 nh 68 nh d1 do not place b1 0 performance can b e optimized at frequency of interest by using recommended component values shown in the table below. reference designation frequency (mhz) 500 2000 2500 3500 c2, c6 100 pf 22 pf 22 pf 22 pf l2 82 nh 22 nh 18 nh 15 nh notes: 1. see pc board layout, page 8 for more information. 2. components shown on the sil kscreen but not on the schematic are not used. 3. b1 (0 jumper) may be replaced with copper trace in the target application layout. 4. the recommended component values are dependent upon the frequency of operation. 5. all components are of 0603 size unless state d on the schematic. q 1 l 2 c 6 c 2 c 1 b 1 j 3 g n d c 2 j 1 r f i n p u t c 6 j 2 r f o u t p u t c 1 b a c k s i d e p a d d l e g r o u n d l 2 q 1 v d d
TQP3M9008 high linearity lna gain block data sheet: rev. j - 5 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance TQP3M9008 - pcb_rf test conditions unless otherwise noted: +25 c, +5v, 8 5 ma , 50 system. notes: 1. oip3 measured with two tones at an output power of + 3 dbm / tone separate d by 1 mhz. 2. noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1db @ 2 ghz . rf performance plots frequency mhz 500 900 1900 2 7 00 3 5 00 40 00 gain db 22 . 8 22.3 20 .6 1 9.0 1 7 .6 1 6.0 input return loss db 10 1 2 16 18 1 0 7 .3 output return loss db 9.5 12 17 1 3 1 2.4 1 4 output p1db dbm +20.9 +19.7 +19. 9 +19. 4 +19.7 +18. 5 oip3 [1] dbm +37.5 +3 7 . 6 +3 6 +35. 3 +34. 7 +33.7 noise figure [2] db 1 .1 1.1 1. 3 1.6 2 2. 5 14 16 18 20 22 24 500 1000 1500 2000 2500 3000 3500 4000 gain (db) frequency (mhz) gain vs. frequency over temp - 40 c - 20 c +25 c +85 ? c - 25 - 20 - 15 - 10 - 5 0 500 1000 1500 2000 2500 3000 3500 4000 s11 (db) frequency (mhz) s11 vs. frequency over temp +85 c +25 c - 40 c - 20 ? c - 20 - 15 - 10 - 5 0 500 1000 1500 2000 2500 3000 3500 4000 s22 (db) frequency (mhz) s22 vs. frequency over temp - 40 c - 20 c +25 c +85 ? c 0 1 2 3 4 500 1000 1500 2000 2500 3000 3500 4000 nf (db) frequency (mhz) noise figure vs. frequency over temp +85 c +25 c - 40 c 25 30 35 40 45 0 3 6 9 12 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over temp f=1900 mhz, 1 mhz tone spacing +25 c +85 c - 40 c 25 30 35 40 45 500 1000 1500 2000 2500 3000 3500 4000 oip3 (dbm) frequency (mhz) oip3 vs. frequency over temp 1 mhz tone spacing, 3 dbm/tone +25 c +85 c - 40 c
TQP3M9008 high linearity lna gain block data sheet: rev. j - 6 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? rf performance plots 14 16 18 20 22 500 1000 1500 2000 2500 3000 3500 4000 p1db (dbm) frequency (mhz) p1db vs. frequency over temp - 40 c +25 c +85 c 70 75 80 85 90 - 40 - 15 10 35 60 85 idd (ma) temperature ( c) idd vs. temperature cw signal 30 35 40 45 50 55 0 500 1000 1500 2000 2500 3000 3500 4000 oip2 (dbm) frequency (mhz) oip2 vs. frequency pout = 3 dbm / tone, 1 mhz spacing, +5v, +25c 25 30 35 40 45 3 4 5 6 7 oip3 (dbm) vdd (volts) oip3 vs. vdd 1900mhz 900mhz pout/tone = 3dbm tone spacing = 1mhz 10 15 20 25 30 3 4 5 6 7 p1db (dbm) vdd (volts) p1db vs. vdd 1900 mhz 900 mhz 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3 4 5 6 7 nf (db) vdd (volts) noise figure vs. vdd 1900mhz 900mhz 65 70 75 80 85 90 3 4 5 6 7 idd (ma) vdd (volts) idd vs vdd
TQP3M9008 high linearity lna gain block data sheet: rev. j - 7 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance tqp3m9 008 - pcb_if test conditions unless otherwise noted: +25oc, +5v, 85 ma, 50 system. notes: 1. oip3 measured with two tones at an output power of +3 dbm / tone separated by 1 mhz. 2. noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1 db @ 2 ghz . if performance plots frequency mhz 7 0 1 00 2 00 5 00 gain db 23.2 23.2 22.9 22.3 input return loss db 10 11 11 1 1 output return loss db 9 9 10 10 output p1db dbm + 19.8 +20. 2 + 19.9 + 19.9 oip3 [1] dbm +37 +37 +37 +37 noise figure [2] db 1.2 1.1 0.8 1.1 15 17 19 21 23 25 0 100 200 300 400 500 gain (db) frequency (mhz) gain vs. frequency over temp - 40 c - 20 c +25 c +85 ? c - 20 - 15 - 10 - 5 0 0 100 200 300 400 500 s11 (db) frequency (mhz) s11 vs. frequency over temp - 40 ? c - 20 c +25 c +85 c - 20 - 15 - 10 - 5 0 0 100 200 300 400 500 s22 (db) frequency (mhz) s22 vs. frequency over temp - 20 c - 40 c +25 c +85 ? c 0 1 2 3 4 0 100 200 300 400 500 nf (db) frequency (mhz) noise figure vs. frequency over temp +85 c +25 c - 40 c 25 30 35 40 45 0 100 200 300 400 500 oip3 (dbm) frequency (mhz) oip3 vs. frequency over temp 1 mhz tone spacing, 3 dbm/tone - 40 c +25 c +85 c 14 16 18 20 22 0 100 200 300 400 500 p1db (dbm) frequency (mhz) p1db vs. frequency over temp - 40 c +25 c +85 c
TQP3M9008 high linearity lna gain block data sheet: rev. j - 8 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? pin description pin symbol description 1 rf in input, matched to 50 ohms . external dc block is required. 2, 4 gnd rf/dc ground connection 3 rfout / vdd output, matched to 50 ohms, external dc block is required and supply voltage evaluation board pcb pc board layout triquint pcb 1075825 material and stack u p rf in gnd rf out gnd 1 2 3 4 1 o z . c u b o t t o m l a y e r n e l c o n - 4 0 0 0 - 1 3 n e l c o n - 4 0 0 0 - 1 3 r = 3 . 7 t y p . n e l c o n - 4 0 0 0 - 1 3 1 o z . c u t o p l a y e r 1 o z . c u i n n e r l a y e r 1 o z . c u i n n e r l a y e r 0 . 0 1 4 " 0 . 0 1 4 " 0 . 0 6 2 0 . 0 0 6 f i n i s h e d b o a r d t h i c k n e s s
TQP3M9008 high linearity lna gain block data sheet: rev. j - 9 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? mechanical information package information and dimensions markings: part number: 3m9008 assembly code: y is last digit of part manufacture year. xxx is lot code. pcb mounting pattern all dimensions are in millimeters (inches). angles are in degrees. notes: 1. ground / thermal vias are critical fo r the proper performance of this device. vias should use a .35mm (#80 / .0135) diameter drill and have a final plated thru diameter of .25 mm (.010). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal perfor mance. 3. rf trace width depends upon the pc board material and construction. 4. use 1 oz. copper minimum. 3m9008 yxxx
TQP3M9008 high linearity lna gain block data sheet: rev. j - 10 of 10 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the global network ? product compliance information esd sensitivity ratings esd rating: 1a value: passes ? ? solderability compatible with both lead - free (260c max. reflow temp.) and lead (245c max. reflow temp.) soldering proces ses. package lead plating: nipdau rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? ? ? ? 15 h 12 br 4 0 2 ) free ? ? msl classification msl rating: 3 floor life: 168 hours max. at 30 c / 60% rh contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.503.615. 9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contain ed herein. triquint assumes no responsibility or liability whatsoever for any of the information contained here in. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is en tirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of su ch information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
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